The effects of polishing pressure and abrasive on the chemical mechanical polishing of blanket and patterned aluminum thin films were investigated. The CMP process experiments were conducted using a soft pad and slurry mainly composed of acid solution and Al O abrasive. The result of the blanket fil
✦ LIBER ✦
Influence of process parameters on chemical-mechanical polishing of copper
✍ Scribed by Z. Stavreva; D. Zeidler; M. Plötner; K. Drescher
- Book ID
- 114155665
- Publisher
- Elsevier Science
- Year
- 1997
- Tongue
- English
- Weight
- 366 KB
- Volume
- 37-38
- Category
- Article
- ISSN
- 0167-9317
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