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Ellipsometry characterization of oxidized copper layers for chemical mechanical polishing process

✍ Scribed by H. Nishizawa; Y. Tateyama; T. Saitoh

Book ID
113936766
Publisher
Elsevier Science
Year
2004
Tongue
English
Weight
188 KB
Volume
455-456
Category
Article
ISSN
0040-6090

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A systematic study of Cu chemical-mechanical polishing (CMP) in terms of process parameters influence, planarization ability of the process and pattern sensitivity of the polish rate was performed. We examined the effects of Cu dishing and SiO z thinning and the reasons for them. Both were found to