Improved Thermal Performance of AlGaN/GaN HEMTs by an Optimized Flip-Chip Design

✍ Scribed by Das, J.; Oprins, H.; Hangfeng Ji; Sarua, A.; Ruythooren, W.; Derluyn, J.; Kuball, M.; Germain, M.; Borghs, G.

• Book ID: 111958862
• Publisher: IEEE
• Year: 2006
• Tongue: English
• Weight: 418 KB
• Volume: 53
• Category: Article
• ISSN: 0018-9383
• DOI: 10.1109/ted.2006.883944