Performance Enhancement of Flip-Chip Packaged AlGaN/GaN HEMTs Using Active-Region Bumps-Induced Piezoelectric Effect

✍ Scribed by Szu-Ping Tsai, ; Heng-Tung Hsu, ; Che-Yang Chiang, ; Yung-Yi Tu, ; Chia-Hua Chang, ; Ting-En Hsieh, ; Huan-Chung Wang, ; Shih-Chien Liu, ; Chang, Edward Yi

• Book ID: 127391118
• Publisher: IEEE
• Year: 2014
• Tongue: English
• Weight: 748 KB
• Volume: 35
• Category: Article
• ISSN: 0741-3106
• DOI: 10.1109/led.2014.2324619