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Improved contacts on a porous silicon layer by electroless nickel plating and copper thickening

✍ Scribed by Kanungo, J; Pramanik, C; Bandopadhyay, S; Gangopadhyay, U; Das, L; Saha, H; Gettens, Robert T T

Book ID: 125420873
Publisher: Institute of Physics
Year: 2006
Tongue: English
Weight: 444 KB
Volume: 21
Category: Article
ISSN: 0268-1242
DOI: 10.1088/0268-1242/21/7/023

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