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Electroless Plating of Copper and Nickel via a Sn-Free Process on Polyimide Films Modified by Surface Graft Copolymerization with 1-Vinylimidazole

✍ Scribed by Zhang, Yan; Tan, K. L.; Yang, G. H.; Kang, E. T.; Neoh, K. G.

Book ID: 126473683
Publisher: The Electrochemical Society
Year: 2001
Tongue: English
Weight: 353 KB
Volume: 148
Category: Article
ISSN: 0013-4651
DOI: 10.1149/1.1387237

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