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Electroless plating of copper on poly(tetrafluoroethylene) films modified by NH[sub 3] plasma and surface graft copolymerization with aniline

✍ Scribed by Ma, Z. H.; Tan, K. L.; Alian, Ayman D.; Kang, E. T.; Neoh, K. G.


Book ID
121844816
Publisher
AVS (American Vacuum Society)
Year
2001
Tongue
English
Weight
477 KB
Volume
19
Category
Article
ISSN
0734-2101

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Electroless Plating of Copper on Fluorin
✍ Wencai C. Wang; Rohit Kumar H. Vora; En T. Kang; Koon G. Neoh πŸ“‚ Article πŸ“… 2003 πŸ› John Wiley and Sons 🌐 English βš– 280 KB

## Abstract Surface modification of two types of fluorinated polyimide (FPI) films, either by plasma polymerization and deposition of 4‐vinylpyridine (4VP) or by UV‐induced graft copolymerization with 4VP under atmospheric conditions, was carried out for adhesion enhancement with the electrolessly