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Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine

✍ Scribed by W.C. Wang; E.T. Kang; K.G. Neoh


Book ID
108417801
Publisher
Elsevier Science
Year
2002
Tongue
English
Weight
361 KB
Volume
199
Category
Article
ISSN
0169-4332

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Electroless Plating of Copper on Fluorin
✍ Wencai C. Wang; Rohit Kumar H. Vora; En T. Kang; Koon G. Neoh πŸ“‚ Article πŸ“… 2003 πŸ› John Wiley and Sons 🌐 English βš– 280 KB

## Abstract Surface modification of two types of fluorinated polyimide (FPI) films, either by plasma polymerization and deposition of 4‐vinylpyridine (4VP) or by UV‐induced graft copolymerization with 4VP under atmospheric conditions, was carried out for adhesion enhancement with the electrolessly