Electroless Plating of Copper on Fluorin
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Wencai C. Wang; Rohit Kumar H. Vora; En T. Kang; Koon G. Neoh
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Article
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2003
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John Wiley and Sons
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English
β 280 KB
## Abstract Surface modification of two types of fluorinated polyimide (FPI) films, either by plasma polymerization and deposition of 4βvinylpyridine (4VP) or by UVβinduced graft copolymerization with 4VP under atmospheric conditions, was carried out for adhesion enhancement with the electrolessly