𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Electroless deposition of copper on polyimide films modified by surface graft copolymerization with nitrogen-containing vinyl monomers

✍ Scribed by G. H. Yang; E. T. Kang; K. G. Neoh; Y. Zhang; K. L. Tan


Book ID
106070202
Publisher
Springer
Year
2001
Weight
214 KB
Volume
279
Category
Article
ISSN
0340-255X

No coin nor oath required. For personal study only.


πŸ“œ SIMILAR VOLUMES


Electroless Plating of Copper on Fluorin
✍ Wencai C. Wang; Rohit Kumar H. Vora; En T. Kang; Koon G. Neoh πŸ“‚ Article πŸ“… 2003 πŸ› John Wiley and Sons 🌐 English βš– 280 KB

## Abstract Surface modification of two types of fluorinated polyimide (FPI) films, either by plasma polymerization and deposition of 4‐vinylpyridine (4VP) or by UV‐induced graft copolymerization with 4VP under atmospheric conditions, was carried out for adhesion enhancement with the electrolessly