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Electroless Plating of Copper via a Sn-Free Process on Dielectric SiLK Surface Modified by UV-Induced Graft Copolymerization with 4-Vinylpyridine and 1-Vinylimidazole

✍ Scribed by Yu, W. H.; Zhang, Yan; Kang, E. T.; Neoh, K. G.; Wu, S. Y.; Chow, Y. F.

Book ID: 126590111
Publisher: The Electrochemical Society
Year: 2002
Tongue: English
Weight: 288 KB
Volume: 149
Category: Article
ISSN: 0013-4651
DOI: 10.1149/1.1507785

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