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Implementation and validation of a new thermal model for analysis, design, and characterization of multichip power electronics devices

✍ Scribed by Profumo, F.; Tenconi, A.; Faceili, S.; Passerini, B.

Book ID
117864619
Publisher
IEEE
Year
1999
Tongue
English
Weight
214 KB
Volume
35
Category
Article
ISSN
0093-9994

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