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Imaging of Thermal Conductivity with Sub-Micrometer Resolution Using Scanning Thermal Microscopy

โœ Scribed by Y. Q. Gu; X. L. Ruan; L. Han; D. Z. Zhu; X. Y. Sun


Book ID
110347607
Publisher
Springer
Year
2002
Tongue
English
Weight
230 KB
Volume
23
Category
Article
ISSN
0195-928X

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## Abstract A scanning thermal microscope with a Wollaston probe was used to investigate the spatial distribution and temporal variation of temperature in interconnect structures subjected to thermal cycling. The probe, utilized in passive temperature sensing mode, was calibrated from 20ยฐC to 200ยฐC