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[IEEE Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium - Dallas, TX USA (March 14-16, 2006)] Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium - Diamond pins utilized as thermal vias for high heat flux spreading in CTE-compatible lids and substrates for semiconductor packaging

✍ Scribed by Saums, D.L.; Edward, B.; Ruzicka, P.; Fennessy, K.; Hay, R.; Zimmer, J.; Sundberg, G.J.

Book ID: 126743423
Publisher: IEEE
Year: 2006
Weight: 701 KB
Category: Article
ISBN-13: 9781424401536
DOI: 10.1109/STHERM.2006.1625223

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