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[IEEE Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium - Dallas, TX USA (March 14-16, 2006)] Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium - Reliability of stack packaging varying the die stacking architectures for flash memory applications

โœ Scribed by Hossain, M.M.; Yongje Lee, ; Akhter, R.; Agonafer, D.; Pekin, S.; Dishongh, T.


Book ID
126687802
Publisher
IEEE
Year
2006
Weight
909 KB
Category
Article
ISBN-13
9781424401536

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