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[IEEE Thermal and Thermomechanical 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - San Diego, CA (May 30-June 2, 2006)] Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - Synthesized Experiments and Analysis of Microchannel Heat Sinks in Electronics Packaging

โœ Scribed by Zhang, H.Y.; Pinjala, D.; Wong, T.N.; Joshi, Y.K.


Book ID
126638393
Publisher
IEEE
Year
2006
Weight
272 KB
Category
Article
ISBN-13
9780780395244

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