𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE Thermal and Thermomechanical 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - San Diego, CA (May 30-June 2, 2006)] Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - Thermal Characterization and Compact Modeling of Stacked Die Packages

✍ Scribed by Szabo, P.; Poppe, A.; Farkas, G.; Szekely, V.; Courtois, B.; Rencz, M.

Book ID: 126676790
Publisher: IEEE
Year: 2006
Weight: 446 KB
Category: Article
ISBN-13: 9780780395244
DOI: 10.1109/ITHERM.2006.1645350

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