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[IEEE Thermal and Thermomechanical 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - San Diego, CA (May 30-June 2, 2006)] Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - Impact of Power Granularity On Chip Thermal Modeling

โœ Scribed by Etessam-Yazdani, K.; Hamann, H.F.; Asheghi, M.


Book ID
124085087
Publisher
IEEE
Year
2006
Weight
397 KB
Category
Article
ISBN-13
9780780395244

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