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[IEEE Thermal and Thermomechanical 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - San Diego, CA (May 30-June 2, 2006)] Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - Experiments and Modeling of Multilayer Copper Minichannel Heat Sinks in Single-Phase Flow

โœ Scribed by Lei, N.; Skandakumaran, P.; Ortega, A.


Book ID
121238442
Publisher
IEEE
Year
2006
Weight
581 KB
Category
Article
ISBN-13
9780780395244

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