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[IEEE The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. - Seoul, Korea (June 5-9, 2005)] The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. - Polysilicon packaging and a new anchoring technology for thick SOI MEMS - dynamic response model and application to over-damped inertial sensors

✍ Scribed by Diem, B.; Barbe, J.C.; de Crecy, F.; Giroud, S.; Renaud, D.; Grange, H.; Hammond, J.; Vandemeer, J.; Roop, R.; Gogoi, B.

Book ID: 120972916
Publisher: IEEE
Year: 2005
Weight: 608 KB
Volume: 1
Category: Article
ISBN-13: 9780780389946
DOI: 10.1109/SENSOR.2005.1496470

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