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[IEEE Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems - Las Vegas, NV, USA (20-24 Jan. 2002)] Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.02CH37266) - Residual stress and fracture of thick dielectric films for power MEMS applications

✍ Scribed by Zhang, X.; Chen, K.-S.; Spearing, S.M.

Book ID: 126645844
Publisher: IEEE
Year: 2002
Weight: 377 KB
Category: Article
ISBN-13: 9780780371859
DOI: 10.1109/MEMSYS.2002.984230

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