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[IEEE Sixth International Symposium on Quality of Electronic Design (ISQED'05) - San Jose, CA, USA (21-23 March 2005)] Sixth International Symposium on Quality of Electronic Design (ISQED'05) - Exploring the Challenges in Creating a High-Quality Mainstream Design Solution for System-in-Package (SiP) Design

✍ Scribed by McCaffrey, B.

Book ID: 121300321
Publisher: IEEE
Year: 2005
Weight: 315 KB
Category: Article
ISBN-13: 9780769523019
DOI: 10.1109/ISQED.2005.56

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