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[IEEE Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium - San Jose, CA, USA (20-22 March 2001)] Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) - Thermal comparison of plate, extrusion heat sink, and skive heat sink

✍ Scribed by Yang, M.C.

Book ID: 126741055
Publisher: IEEE
Year: 2001
Weight: 815 KB
Category: Article
ISBN-13: 9780780366497
DOI: 10.1109/STHERM.2001.915156

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