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[IEEE Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium - San Jose, CA, USA (20-22 March 2001)] Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) - Thermal analysis of power cycling effects on high power IGBT modules by the boundary element method

✍ Scribed by Khatir, Z.; Lefebvre, S.

Book ID: 121333355
Publisher: IEEE
Year: 2001
Tongue: English
Weight: 833 KB
Category: Article
ISBN-13: 9780780366497
DOI: 10.1109/STHERM.2001.915141

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