[IEEE Proceedings of the IEEE 2002 International Interconnect Technology Conference - Burlingame, CA, USA (2002.06.5-2002.06.5)] Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat No 02EX519) IITC-02 - Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519)

[IEEE IEEE 2002 International Interconne

[IEEE IEEE 2002 International Interconnect Technology Conference - Burlingame, CA, USA (3-5 June 2002)] Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) - Scaling trends for the on chip power dissipation

✍ Chandra, G.; Kapur, P.; Saraswat, K.C. 📂 Article 📅 2002 🏛 IEEE 🌐 English ⚖ 206 KB

[IEEE IEEE 2002 International Interconne

[IEEE IEEE 2002 International Interconnect Technology Conference - Burlingame, CA, USA (3-5 June 2002)] Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) - Comparisons between electrical and optical interconnects for on-chip signaling

✍ Kapur, P.; Saraswat, K.C. 📂 Article 📅 2002 🏛 IEEE 🌐 English ⚖ 237 KB

[IEEE IEEE 2002 International Interconne

[IEEE IEEE 2002 International Interconnect Technology Conference - Burlingame, CA, USA (3-5 June 2002)] Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) - Towards a comparison between chip-level optical interconnection and board-level exterconnection

✍ Mule, A.V.; Naeemi, A.; Glytsis, E.N.; Gaylord, T.K.; Meindl, J.D. 📂 Article 📅 2002 🏛 IEEE 🌐 English ⚖ 224 KB

[IEEE IEEE 2002 International Interconne

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[IEEE IEEE 2002 International Interconne

[IEEE IEEE 2002 International Interconnect Technology Conference - Burlingame, CA, USA (3-5 June 2002)] Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) - Integrated chip-scale simulation of pattern dependencies in copper electroplating and copper chemical mechanical polishing processes

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[IEEE IEEE 2002 International Interconne

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