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[IEEE Ninth IEEE/CHMT International Symposium on Electronic Manufacturing Technology,Competitive Manufacturing for the Next Decade - Washington, DC, USA (1-3 Oct. 1990)] Ninth IEEE/CHMT International Symposium on Electronic Manufacturing Technology,Competitive Manufacturing for the Next Decade - Highly reliable Au-Sn bonding with background GaAs LSI chips

✍ Scribed by Nishiguchi, M.; Goto, N.; Mishizawa, H.

Book ID: 124091374
Publisher: IEEE
Year: 1990
Weight: 857 KB
Category: Article
DOI: 10.1109/IEMT9.1990.115009

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