✦ LIBER ✦
[IEEE Ninth IEEE/CHMT International Symposium on Electronic Manufacturing Technology,Competitive Manufacturing for the Next Decade - Washington, DC, USA (1-3 Oct. 1990)] Ninth IEEE/CHMT International Symposium on Electronic Manufacturing Technology,Competitive Manufacturing for the Next Decade - Nondestructive evaluation of TAB bonding by means of acoustic microscopy: overview of progress using C-mode scanning acoustic microscopy
✍ Scribed by Semmens, J.E.; Kessler, L.W.
- Book ID
- 118069113
- Publisher
- IEEE
- Year
- 1990
- Weight
- 917 KB
- Volume
- 0
- Category
- Article
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