𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Aging effects of Epoxy Moulding Compound on the long-term stability of plastic package

✍ Scribed by Nguegang, Eric; Franz, Jochen; Kretschmann, Andre; Sandmaier, Hermann

Book ID: 127145060
Publisher: IEEE
Year: 2010
Weight: 410 KB
Category: Article
ISBN: 1424470269
DOI: 10.1109/esime.2010.5464615

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