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[IEEE InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88 - Los Angeles, CA, USA (11-13 May 1988)] InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88 - Heat transfer augmentation in a foam-material filled duct with discrete heat sources

✍ Scribed by Kuo, S.M.; Tien, C.L.

Book ID: 126922409
Publisher: IEEE
Year: 1988
Weight: 387 KB
Category: Article
DOI: 10.1109/itherm.1988.28684

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