✦ LIBER ✦

[IEEE International Electron Devices Meeting - Washington, DC, USA (10-13 Dec. 1995)] Proceedings of International Electron Devices Meeting - A comparative study of CVD TiN and CVD TaN diffusion barriers for copper interconnection

✍ Scribed by Sun, S.C.; Tsai, M.H.; Chiu, H.T.; Chuang, S.H.; Tsai, C.E.

No coin nor oath required. For personal study only.

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