[IEEE International Electron Devices Meeting. IEDM Technical Digest - Washington, DC, USA (7-10 Dec. 1997)] International Electron Devices Meeting. IEDM Technical Digest - Modeling of pattern-dependent on-chip interconnect geometry variation for deep-submicron process and design technology

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✍ Yoshida, I. 📂 Article 📅 1997 🏛 IEEE ⚖ 368 KB

[IEEE International Electron Devices Mee

✍ Ashley, T.; Dean, A.B.; Elliott, C.T.; Jefferies, R.; Khaleque, F.; Phillips, T. 📂 Article 📅 1997 🏛 IEEE ⚖ 353 KB

[IEEE International Electron Devices Mee

✍ Bimberg, D.; Ledentsov, N.N.; Grundmann, M.; Heinrichsdorff, F.; Ustinov, V.M.; 📂 Article 📅 1997 🏛 IEEE ⚖ 432 KB

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✍ van Langevelde, R.; Klaassen, F.M. 📂 Article 📅 1997 🏛 IEEE ⚖ 410 KB

[IEEE International Electron Devices Mee

✍ Versari, R.; Pieracci, A.; Manzini, S.; Contiero, C.; Ricco, B. 📂 Article 📅 1997 🏛 IEEE ⚖ 356 KB

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✍ Wei Long, ; Chin, K.K. 📂 Article 📅 1997 🏛 IEEE ⚖ 347 KB