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[IEEE IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems - Kyoto, Japan (19-23 Jan. 2003)] The Sixteenth Annual International Conference on Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE - Field-assisted bonding of glass to Si-Au eutectic solder for packaging applications

✍ Scribed by Harpster, T.J.; Najafi, K.

Book ID: 120254655
Publisher: IEEE
Year: 2003
Weight: 469 KB
Category: Article
ISBN-13: 9780780377448
DOI: 10.1109/MEMSYS.2003.1189828

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