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[IEEE IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest. - Tempe, Arizon, USA (Dec. 5, 2005)] IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest. - Electro-thermal transport in metallic single-wall carbon nanotubes for interconnect applications

✍ Scribed by Pop, E.; Mann, D.; Reifenberg, J.; Goodson, K.; Hongjie Dai,

Book ID: 120936230
Publisher: IEEE
Year: 2005
Tongue: English
Weight: 349 KB
Category: Article
ISBN-13: 9780780392687
DOI: 10.1109/IEDM.2005.1609321

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