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[IEEE IEEE International Integrated Reliability Workshop - Lake Tahoe, CA, USA (21-24 Oct. 2002)] IEEE International Integrated Reliability Workshop Final Report, 2002. - Electromigration test on via line structure with a self-heated method

✍ Scribed by Yap, H.K.; Yap, A.; Tan, Y.C.; Lo, K.F.

Book ID: 126713850
Publisher: IEEE
Year: 2002
Tongue: English
Weight: 204 KB
Category: Article
ISBN-13: 9780780375581
DOI: 10.1109/IRWS.2002.1194258

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