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[IEEE IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP '93) - Pocono Manor, PA, USA (17-20 Oct. 1993)] Proceedings of IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP '93) - Enhancement of breakdown strength of polyetherimide laminates

โœ Scribed by Zheng, J.P.; Cygan, P.; Jow, T.R.


Book ID
126760715
Publisher
IEEE
Year
1993
Weight
267 KB
Category
Article
ISBN-13
9780780309661

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