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[IEEE IEEE 1998 International Interconnect Technology Conference - San Francisco, CA, USA (1-3 June 1998)] Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) - Molecular dynamics simulation of Al grain boundary diffusion for electromigration failure analysis

✍ Scribed by Shinzawa, T.; Ohta, T.

Book ID: 126689117
Publisher: IEEE
Year: 1998
Tongue: English
Weight: 279 KB
Category: Article
ISBN-13: 9780780342859
DOI: 10.1109/IITC.1998.704743

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