𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - 12-channel board-level multi-GHz optical link using cross-switch chips and optoelectronic multi-chip package modules

✍ Scribed by Fengman Liu, ; Zhihua Li, ; Wei Gao, ; Haifei Xiang, ; Jian Song, ; Baoxia Li, ; Lixi Wan,

Book ID: 125506390
Publisher: IEEE
Year: 2010
Weight: 881 KB
Category: Article
ISBN: 1424481406
DOI: 10.1109/ICEPT.2010.5583802

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - A miniaturized multi-layer lowpass filter for microwave application

✍ Zhao Yingbo, ; Li Yuejin, ; Xing Mengjiang, 📂 Article 📅 2010 🏛 IEEE ⚖ 786 KB

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Study of Mixed-signal crosstalk in 3-D package

✍ Shuhua Liu, ; Liqiang Cao, ; Jun Li, ; Yunyan Zhou, ; Jing Zhou, ; Qidong Wang, 📂 Article 📅 2010 🏛 IEEE ⚖ 846 KB

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Piezoresistive pressure sensors based on system in packaging technology of MEMS

✍ Xiong Shi, ; Jian Xu, ; Zhiyin Gan, ; Sheng Liu, 📂 Article 📅 2010 🏛 IEEE ⚖ 696 KB

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Optimization of packaging process of piezoresistive engine oil pressure sensor

✍ Zongyang Zhang, ; Chaojun Liu, ; Zhimin Wan, ; Gang Cao, ; Yun Lu, ; Bin Song, ; 📂 Article 📅 2010 🏛 IEEE ⚖ 831 KB

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Novel compact compass navigation system (CNS) power divider

✍ Li Yuejin, ; Xing Mengjiang, ; Zhu Zhangming, ; Yang Yintang, 📂 Article 📅 2010 🏛 IEEE ⚖ 781 KB

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Design of electronic circuits of nanosecond impulser based on avalanche transistor

✍ Qingping Wu, ; Wenchao Tian, 📂 Article 📅 2010 🏛 IEEE ⚖ 439 KB