𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Thin film encapsulation for OLED display using silicon nitride and silicon oxide composite film

✍ Scribed by Sang, Renzheng; Zhang, Hao; Long, Li; Hua, Zikai; Yu, Jianling; Wei, Bin; Wu, Xingyang; Feng, Tao; Zhang, Jianhua

Book ID: 126717096
Publisher: IEEE
Year: 2011
Weight: 1017 KB
Category: Article
ISBN: 1457717700
DOI: 10.1109/ICEPT.2011.6067036

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Simulation of reconfigurable antenna based on RF switch

✍ Wenchao, Tian; Yanrong, Cao; Hao, Sun 📂 Article 📅 2011 🏛 IEEE ⚖ 541 KB

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - The common failure mechanisms of plastic encapsulated devices induced by package defect

✍ Chen, Yuan; Li, Ping 📂 Article 📅 2011 🏛 IEEE ⚖ 875 KB

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Reliability study on high power LED with chip on board

✍ Liu, Dongjing; Yang, D.G.; Ren, Rongbin; Hou, Fengze; Huang, Chao 📂 Article 📅 2011 🏛 IEEE ⚖ 628 KB

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Junction temperature study during degradation process of high power light-emitting diodes

✍ Chen, Quan; Luo, Xiaobing; Chen, Run; Wang, Sang; Chen, Zhaohui; Liu, Sheng 📂 Article 📅 2011 🏛 IEEE ⚖ 725 KB

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - The flip chip market and supply chain are being reshaped by new requirements and technologies

✍ Cadix, Lionel; Yannou, Jean-Marc; Zinc, Christophe 📂 Article 📅 2011 🏛 IEEE ⚖ 530 KB

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Structural design and heat dissipation research of integrated 3W white LED miner's lamp

✍ Ren, Rongbin; Yang, Daoguo; Liu, Dongjing 📂 Article 📅 2011 🏛 IEEE ⚖ 473 KB