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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Reliability study on high power LED with chip on board

✍ Scribed by Liu, Dongjing; Yang, D.G.; Ren, Rongbin; Hou, Fengze; Huang, Chao

Book ID: 125506391
Publisher: IEEE
Year: 2011
Weight: 628 KB
Category: Article
ISBN: 1457717700
DOI: 10.1109/ICEPT.2011.6066998

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