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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - The flip chip market and supply chain are being reshaped by new requirements and technologies

✍ Scribed by Cadix, Lionel; Yannou, Jean-Marc; Zinc, Christophe

Book ID: 124098553
Publisher: IEEE
Year: 2011
Weight: 530 KB
Category: Article
ISBN: 1457717700
DOI: 10.1109/ICEPT.2011.6066809

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