𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - High-Q on-chip inductors embedded in wafer-level package for RFIC applications

✍ Scribed by Tao Feng, ; Jian Cai, ; Kwon, Henri H.K.; Qian Wang, ; Xinyu Dou,

Book ID: 120052435
Publisher: IEEE
Year: 2008
Tongue: English
Weight: 270 KB
Category: Article
ISBN: 1424427398
DOI: 10.1109/ICEPT.2008.4606957

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Thermo and mechanical study on integrated high-density packaging

✍ Qian Chen, ; Yi-ping Wu, ; Feng-shun Wu, ; Zhi-jun Zhu, ; Yuan Tao, 📂 Article 📅 2008 🏛 IEEE ⚖ 624 KB

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - SiP/SoP technology and its implementation

✍ Lixi Wan, 📂 Article 📅 2008 🏛 IEEE ⚖ 245 KB

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - A high speed image preprocessing method for IC wafer inspection

✍ Chen, Wei; Wu, Li-Ming; Cui, Shan-Ling 📂 Article 📅 2008 🏛 IEEE 🌐 English ⚖ 368 KB

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Methodology for modeling simultaneous switching noise in BGA packaging

✍ Song Li, ; Xue-tao Weng, 📂 Article 📅 2008 🏛 IEEE ⚖ 174 KB

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Attenuators using thin film resistors for RF application

✍ Yiqin Sun, ; Lei Li, ; Han Lin, ; Zhiyuan Yu, ; Mian Huang, ; Lixi Wan, 📂 Article 📅 2008 🏛 IEEE 🌐 English ⚖ 190 KB

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Recent progress of ohmic contact on ZnO

✍ Yao Lv, ; Lixi Wan, 📂 Article 📅 2008 🏛 IEEE 🌐 English ⚖ 281 KB