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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - A high speed image preprocessing method for IC wafer inspection

✍ Scribed by Chen, Wei; Wu, Li-Ming; Cui, Shan-Ling

Book ID: 118266047
Publisher: IEEE
Year: 2008
Tongue: English
Weight: 368 KB
Volume: 0
Category: Article
ISBN: 1424427398
DOI: 10.1109/icept.2008.4607103

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