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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - The principal component analysis of Cu stud bump shaping process parameters

✍ Scribed by Mu, Wei; Wu, Zhaohua; Huang, Chunyue

Book ID: 126639710
Publisher: IEEE
Year: 2009
Weight: 1012 KB
Category: Article
ISBN: 1424446589
DOI: 10.1109/ICEPT.2009.5270733

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