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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Wetting behaviour of lead free solder on electroplated Ni and Ni-W alloy barrier film

✍ Scribed by Chew, C. S.; Haseeb, A. S. M. A.; Johan, M. R.

Book ID: 120925837
Publisher: IEEE
Year: 2009
Weight: 834 KB
Category: Article
ISBN: 1424446589
DOI: 10.1109/ICEPT.2009.5270639

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