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[IEEE High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - (2007.06.26-2007.06.28)] High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - Reliability Analysis of SiP Structures

✍ Scribed by Bailey, Chris; Stoyanov, Stoyan; Strusevich, Nadia; Yannou, Jean-Marc

Book ID: 126727545
Publisher: IEEE
Year: 2007
Weight: 343 KB
Category: Article
ISBN-13: 9781424412532
DOI: 10.1109/HDP.2007.4283556

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