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[IEEE High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - (2007.06.26-2007.06.28)] High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - Microwave Curing of Materials for High Density Packaging

✍ Scribed by Goussetis, G.; Sinclair, K.I.; Sangster, A.J.; Desmulliez, M.P.Y.; Tilford, T.; Parrott, A.K; Bailey, C.

Book ID: 120965248
Publisher: IEEE
Year: 2007
Weight: 129 KB
Category: Article
ISBN-13: 9781424412532
DOI: 10.1109/HDP.2007.4283552

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