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[IEEE High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - (2007.06.26-2007.06.28)] High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - The Development of Paddle Shift Analysis for IC Packaging Processing

✍ Scribed by Chen, Stoke; Shen, G. S.; Chen, J. Y.; Teng, S. Y.; Hwang, S. J.; Lin, Y. J.; Lee, H. H.; Huang, D. Y.

Book ID: 126676698
Publisher: IEEE
Year: 2007
Weight: 1016 KB
Category: Article
ISBN-13: 9781424412532
DOI: 10.1109/HDP.2007.4283565

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