𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. SEMI-THERM. 1999 - San Diego, CA, USA (9-11 March 1999)] Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) - Thermal management of heat spreader materials for flip chip type package

✍ Scribed by Hirose, Y.; Yamagata, S.-I.; Imamura, M.; Abe, Y.; Fukui, A.; Shimazu, M.; Fujimori, N.

Book ID: 126631167
Publisher: IEEE
Year: 1999
Weight: 529 KB
Category: Article
ISBN-13: 9780780352643
DOI: 10.1109/STHERM.1999.762435

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE Fifteenth Annual IEEE Semiconducto

[IEEE Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. SEMI-THERM. 1999 - San Diego, CA, USA (9-11 March 1999)] Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) - New way for thermal transient testing [IC packaging]

✍ Szekely, V.; Rencz, M.; Poppe, A.; Courtois, B. 📂 Article 📅 1999 🏛 IEEE 🌐 English ⚖ 571 KB

[IEEE Fifteenth Annual IEEE Semiconducto

[IEEE Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. SEMI-THERM. 1999 - San Diego, CA, USA (9-11 March 1999)] Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) - Thermal modeling of diamond-based power electronics packaging

✍ Fabis, P.M.; Shum, D.; Windischmann, H. 📂 Article 📅 1999 🏛 IEEE 🌐 English ⚖ 541 KB

[IEEE Fifteenth Annual IEEE Semiconducto

[IEEE Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. SEMI-THERM. 1999 - San Diego, CA, USA (9-11 March 1999)] Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) - Thermal parameter estimation in the presence of uncertainty [packaging]

✍ Emery, A.F. 📂 Article 📅 1999 🏛 IEEE ⚖ 303 KB

[IEEE Fifteenth Annual IEEE Semiconducto

[IEEE Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. SEMI-THERM. 1999 - San Diego, CA, USA (9-11 March 1999)] Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) - Thermal impact of solder voids in the electronic packaging of power devices

✍ Zhu, N. 📂 Article 📅 1999 🏛 IEEE ⚖ 643 KB

[IEEE Fifteenth Annual IEEE Semiconducto

[IEEE Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. SEMI-THERM. 1999 - San Diego, CA, USA (9-11 March 1999)] Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) - Analytical forced convection modeling of plate fin heat sinks

✍ Teertstra, P.; Yovanovich, M.M.; Culham, J.R.; Lemczyk, T. 📂 Article 📅 1999 🏛 IEEE 🌐 English ⚖ 621 KB

[IEEE Fifteenth Annual IEEE Semiconducto

[IEEE Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. SEMI-THERM. 1999 - San Diego, CA, USA (9-11 March 1999)] Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) - Junction-to-top and junction-to-board thermal resistance measurement for 119 BGA packages

✍ Chung, T.; Kim, M.; Baek, J.; Oh, S. 📂 Article 📅 1999 🏛 IEEE 🌐 English ⚖ 463 KB