𝔖 Bobbio Scriptorium

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[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Thermo-mechanical finite-element modeling of a chip-on-foil bonding process

✍ Scribed by Suter, P.; Bauknecht, R.; Graf, T.; Duran, H.; Venter, I.

Book ID: 126748112
Publisher: IEEE
Year: 2005
Weight: 896 KB
Category: Article
ISBN-13: 9780780390621
DOI: 10.1109/ESIME.2005.1502766

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📜 SIMILAR VOLUMES

[IEEE EuroSimE 2005. 6th International C

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