𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Design of a high-Q CMOS-compatible MEMS tunable capacitor for RF applications

✍ Scribed by Nasirzadeh, N.; Abbaspour, E.; Dadashzadeh, G.

Book ID: 121002613
Publisher: IEEE
Year: 2005
Weight: 493 KB
Category: Article
ISBN-13: 9780780390621
DOI: 10.1109/ESIME.2005.1502824

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE EuroSimE 2005. 6th International C

[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Dynamic macromodels for sensor devices

✍ Hauck, T.; Thanner, M.; O'Brien, G. 📂 Article 📅 2005 🏛 IEEE ⚖ 771 KB

[IEEE EuroSimE 2005. 6th International C

[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Modeling of integrated inductors and transformers for RF applications

✍ Lopez-Villegas, J.M.; Sieiro, J. 📂 Article 📅 2005 🏛 IEEE ⚖ 765 KB

[IEEE EuroSimE 2005. 6th International C

[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Muftiphysles for topology optimization in HEMS

✍ Korvink, J.G.; Zhenyu Liu, 📂 Article 📅 2005 🏛 IEEE ⚖ 865 KB

[IEEE EuroSimE 2005. 6th International C

[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Viscoelastic characterization of fast curing moulding compounds

✍ Milosheva, B.V.; Jansen, K.M.B.; Janssen, J.H.J.; Bressers, H.J.L.; Ernst, L.J. 📂 Article 📅 2005 🏛 IEEE ⚖ 790 KB

[IEEE EuroSimE 2005. 6th International C

[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Thermal cycling simulation in electronic packages using molecular dynamic method

✍ Fan, H.B.; Chan, E.K.L.; Wong, C.K.Y.; Yuen, M.M.F. 📂 Article 📅 2005 🏛 IEEE ⚖ 825 KB

[IEEE EuroSimE 2005. 6th International C

[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Validation of FE modea for transient hot wire thermal conductivity measurements

✍ Bilek, J.; Atkinson, J.; Wakeham, W. 📂 Article 📅 2005 🏛 IEEE ⚖ 915 KB