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[IEEE Eleventh Biennial University/Government/ Industry Microelectronics Symposium - Austin, TX, USA (16-17 May 1995)] Proceedings of the Eleventh Biennial University/Government/ Industry Microelectronics Symposium - An investigation of the chemical mechanical polishing of copper thin films to form in-laid interconnections in the dielectric (SiO/sub 2/) films

✍ Scribed by Steigerwald, J.M.; Murarka, S.P.; Gutmann, R.J.; Duquette, D.J.

Book ID: 126722516
Publisher: IEEE
Year: 1995
Weight: 130 KB
Category: Article
ISBN-13: 9780780325968
DOI: 10.1109/UGIM.1995.514129

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